TEMPE, Ariz. — CCBill will participate in a series of European-based trade events in September, presenting the newest consumer payments platform, FlexForms, and its new stored payment option, CCBill Pay.
The tour will find the CCBill team participating in a number of relevant panel discussions, hands-on workshop sessions and seminars.
In addition, CCBill will be showcasing their menu of payment services tools, designed to automate business payment processing, consumer trust and help online businesses grow beyond their expectations.
The latest product releases and platform improvements will be presented to existing and potential clients and partners — FlexForms 2.0, CCBill Pay, Merchant Connect, ACH Payouts and more.
“This year, our trek to Europe is coming at a big moment for CCBill, as we launch two new products which have been in the works for some time — the next wave of FlexForms 2.0 and our much-anticipated CCBill Pay,” said Gary Jackson, CCBill’s managing vice president of sales. “Both releases, along with the accelerated growth of the Merchant Connect network participants, position CCBill as the leading solution for today’s fast moving buyers.
"It’s a big world of consumers and affiliates and opportunity — and it’s just waiting for the right partners to help our merchants capture the business.”
The three-week tour starts with XBIZ Berlin, in one of CCBill’s largest markets for merchants and payment options. Jackson will address localized payment types on the billing panel in Berlin.
CCBill will move over to Amsterdam for Webmaster Access before zipping off to Prague for The European Summit and then to iDate 2016 in London.
At iDate, CCBill execs will be discussing the relevance of its new consumer wallet in online dating and introduce CCBill Pay to the U.K. market.
For more information on meeting with CCBill at any of these shows, contact the company directly at ccbill@ccbill.com or by visiting their website at CCBill.com.
For more information on XBIZ Berlin, visit its official website or follow on Twitter.
